Dry Etching Tools

• Oxford Instrument Plasma Pro 100 Estrelas (DRIE)

  Chemical: Oâ‚‚,ÌýAr, SF₆, C₄F₈
  Application: High-aspect-ratio etching for MEMS and other applications

• Applied Material AM5000 (RIE)

  Chemical: Cl₂, CF₄, CHF₃, SF₆, O₂, Ar
  Application: Versatile plasma etching for various materials

• Plasma Therm APEC SLR (ICP-RIE)

  Chemical: Cl₂, BCl₃, SiCl₄, CH₄, H₂, Ar, SF₆, CF₄, O₂
  Application: Precise etching for III-V and IV semiconductors

• Xactix E2 (XeFâ‚‚ Isotropic Etching)

  Application: Isotropic etching of silicon and compatible materials

• Nanoplus DSB6000 (Oxygen Plasma Etching)

  Application: Cleaning, resist stripping, and surface modification

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Wet Etching and Cleaning Stations

• HF Wet Bench

  Application: Hydrofluoric acid etching for oxide removal

• Acid/Base Bench

  Application: General-purpose chemical etching for various materials

• KOH/TMAH Bench

  Application: Wet etching of silicon for anisotropic patterns

• General Solvent Bench

  Application: Solvent cleaning and preparation of materials

• Litho Solvent Bench

  Application: Specialized solvent processes for lithography

• Ultrasonic Cleaner

  Application: Efficient cleaning of substrates and small components