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MECH 553 Design and Manufacture of Microdevices (3 credits)

Offered by: Génie mécanique (Génie et l'architecture)

Vue d'ensemble

Génie mécanique : Introduction to microelectromechanical systems (MEMS). Micromachining techniques (thin-film deposition; lithography; etching; bonding). Microscale mechanical behaviour (deformation and fracture; residual stresses; adhesion; experimental techniques). Materials- and process-selection. Process integration. Design of microdevice components to meet specified performance and reliability targets using realistic manufacturing processes.

Terms: Automne 2009

Instructors: Vengallatore, Srikar (Fall)

  • (3-0-6)
  • Prerequisite: Instructor's permission.
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